US Patent Issued to CHIPBOND TECHNOLOGY on Jan. 27 for "Semiconductor package and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,805, issued on Jan. 27, was assigned to CHIPBOND TECHNOLOGY Corp. (Hsinchu, Taiwan).

"Semiconductor package and method of manufacturing the same" was invented by Shrane-Ning Jenq (Hsinchu County, Taiwan), Chen-Yu Wang (Hsinchu, Taiwan), Chin-Tang Hsieh (Kaohsiung, Taiwan), Shu-Yeh Chang (Hsinchu, Taiwan) and Lung-Hua Ho (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a method of manufacturing a semiconductor package, at least one conductive wire is formed on a substrate in a wire bonding process, a ball end of the conductive wire is located above the substrate, a molding material is provided to cover the conductive wire except the...