ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,481, issued on Jan. 13, was assigned to CHIPBOND TECHNOLOGY Corp. (Hsinchu, Taiwan).
"Clamp assembly" was invented by Ching-Wen Chen (Hsinchu County, Taiwan), Chen-Lung Teng (Hsinchu, Taiwan), Kung-An Lin (Hsinchu, Taiwan) and Chen-Yu Wang (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A clamp assembly includes at least one clamp which is provided to clamp a workpiece in electroless plating, etching, electroplating or cleaning process. The clamp includes a base, a clamping element and a limiting element. The base is mounted on a carrier and includes a guide hole and a first limiting hole which are communicated with each other. The c...