ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,262, issued on Feb. 3, was assigned to CHIPBOND TECHNOLOGY Corp. (Hsinchu, Taiwan).
"Thin film circuit board" was invented by Kung-Tzu Tu (Kaohsiung, Taiwan), Gwo-Shyan Sheu (Kaohsiung, Taiwan), Kuo-Liang Huang (Kaohsiung, Taiwan), Pei-Wen Wang (Taichung, Taiwan), Yu-Chen Ma (Kaohsiung, Taiwan) and Chia-Hsin Yen (Kaohsiung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thin film circuit board includes a substrate and a thermal conductive film which is adhered to the substrate and includes a first conductive portion, a second conductive portion and a third conductive portion. The thermal conductive film is designed to be polygonal and non-re...