ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,265, issued on Feb. 3, was assigned to CHIPBOND TECHNOLOGY Corp. (Hsinchu, Taiwan).
"Semiconductor package and chip thereof" was invented by Wei-Hsin Wu (Hsinchu County, Taiwan), Ku-Pang Chang (Hsinchu, Taiwan) and Chun-Chia Yeh (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a flexible circuit board and a chip which includes a first bump group and a second bump group. First bumps of the first bump group and second bumps of the second bump group are provided to be bonded to leads on the flexible circuit board. The second bumps are designed to be longer than the first bumps in length so as to inc...