US Patent Issued to CHIPBOND TECHNOLOGY on Feb. 3 for "Flip-chip bonding structure and substrate thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,581, issued on Feb. 3, was assigned to CHIPBOND TECHNOLOGY Corp. (Hsinchu, Taiwan).

"Flip-chip bonding structure and substrate thereof" was invented by Chin-Tang Hsieh (Kaohsiung, Taiwan), Lung-Hua Ho (Hsinchu, Taiwan), Chih-Ming Kuo (Hsinchu County, Taiwan), Chun-Ting Kuo (Kaohsiung, Taiwan), Yu-Hui Hu (Pingtung County, Taiwan), Chih-Hao Chiang (Hsinchu County, Taiwan), Chen-Yu Wang (Hsinchu, Taiwan), Kung-An Lin (Hsinchu, Taiwan) and Pai-Sheng Cheng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A flip-chip bonding structure includes a substrate and a chip. A lead of the substrate includes a body, a hollow opening, a bonding island...