US Patent Issued to CHINGIS TECHNOLOGY on Jan. 13 for "Package structure with at least two dies and at least one spacer" (California Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,514, issued on Jan. 13, was assigned to CHINGIS TECHNOLOGY Corp. (Hsinchu, Taiwan).

"Package structure with at least two dies and at least one spacer" was invented by Cheng-Fu Yu (Milpitas, Calif.), Kai-Jih Shih (Milpitas, Calif.) and Chi-Yi Wu (Milpitas, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a leadframe, at least two dies, at least one spacer and a plastic package material. The leadframe includes a die pad. The dies are disposed on the die pad of the leadframe. The spacer is disposed between at least one of the dies and the die pad. The plastic package material is disposed on the leadframe, and covers th...