US Patent Issued to CHINA UNIVERSITY OF MINING AND TECHNOLOGY, BEIJING on May 27 for "Method of segmented grouting for repairing aquifers in mining area" (Chinese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,312,958, issued on May 27, was assigned to CHINA UNIVERSITY OF MINING AND TECHNOLOGY, BEIJING (Beijing).

"Method of segmented grouting for repairing aquifers in mining area" was invented by Yifan Zeng (Beijing), Weihong Yang (Beijing), Qiang Wu (Beijing), Xinjiang Wei (Beijing), Kai Pang (Beijing), Xuan Xiao (Beijing) and Xue Liu (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a method of segmented grouting for repairing aquifers in a mining area after mining. The method may include: drilling a grouting hole in a ground area corresponding to a water inflow position in a goaf; and performing a segmented grouting in a target grouting ...