US Patent Issued to Chengji Bao on Feb. 10 for "Heat insulation composite board and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,546,112, issued on Feb. 10, was assigned to Chengji Bao (Zhejiang, China).

"Heat insulation composite board and manufacturing method thereof" was invented by Chengji Bao (Zhejiang, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure provides a heat insulation composite board and a manufacturing method thereof. The heat insulation composite board includes at least one heat insulation layer, at least one medium layer and at least one outer surface layer, wherein the heat insulation layer and the medium layer are joined into a whole in a physical manner; and the outer surface layer and the medium layer are joined into a whole in a chemical ...