ALEXANDRIA, Va., June 18 -- United States Patent no. 12,328,972, issued on June 10, was assigned to Chengdu Vistar Optoelectronics Co. Ltd. (Chengdu, China).
"Bonding method of micro-light emitting diode chip" was invented by Xiaobiao Dong (Kunshan, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "The bonding method of a micro-light emitting diode chip includes providing a backplane, and two solder columns are formed on electrodes of each chip bonding area of the backplane; forming a glue groove in the chip bonding area, forming a glue layer in the glue groove to make the glue layer cover tops of the solder columns; moving the chip to make positive and negative electrodes of the chip aligned with the two...