US Patent Issued to Chengdu University Of Technology on April 1 for "Thickening device and method for uniform solidification of composite lost circulation material made up of liquid and granular lost circulation materials" (Chinese Inventors)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,263,453, issued on April 1, was assigned to Chengdu University Of Technology (Chengdu, China).

"Thickening device and method for uniform solidification of composite lost circulation material made up of liquid and granular lost circulation materials" was invented by Jiping She (Chengdu, China), Wenjing Ma (Chengdu, China), Furong Gong (Chengdu, China), Yunfei Wang (Chengdu, China), Gege Teng (Chengdu, China), Shiyu Zhang (Chengdu, China) and Huimin Li (Chengdu, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The provided are a thickening device and method for uniform solidification of composite lost circulation material made up of liquid and granula...