US Patent Issued to Chengdu Sicore Semiconductor on June 24 for "Stacked die RF circuits and package method thereof" (California Inventor)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,133, issued on June 24, was assigned to Chengdu Sicore Semiconductor Corp. Ltd. (Sichuan, China).

"Stacked die RF circuits and package method thereof" was invented by Cemin Zhang (Chino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments for die stacking are disclosed in the present disclosure for improved performance in RF circuit integration and packaging. In various layouts, a first die may be flipped and stacked on a second die via one or more bumping pillars coupled between the dies. The bumping pads may be disposed on the first die, the second die, or both. The bumping pads may comprise ground bumping pads for ground con...