US Patent Issued to Chengdu Monolithic Power Systems on Sept. 16 for "Integrated circuit unit and wafer with integrated circuit units" (Chinese, American Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,986, issued on Sept. 16, was assigned to Chengdu Monolithic Power Systems Co. Ltd. (Sichuan, China).

"Integrated circuit unit and wafer with integrated circuit units" was invented by Liwei Hou (Chengdu, China), Suwei Wang (Chengdu, China), Heng Li (Chengdu, China), Ze-Qiang Yao (Santa Clara, Calif.) and Junjian Zhao (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit ("IC") unit and a wafer for fabricating IC units. The wafer has a first surface and a second surface opposite to the first surface. A redistribution metal layer may be formed on the first surface and may be patterned to have a redistribution metal layer ...