US Patent Issued to Chengdu ECHINT Technology on Oct. 7 for "Semiconductor package and method of forming the same with dielectric layer disposed between protective mold structure and stepped structure of side portion of semiconductor die" (Chinese Inventor)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,086, issued on Oct. 7, was assigned to Chengdu ECHINT Technology Co. Ltd. (West Chengdu, China).

"Semiconductor package and method of forming the same with dielectric layer disposed between protective mold structure and stepped structure of side portion of semiconductor die" was invented by Cheng-Tar Wu (Chengdu, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a semiconductor package is disclosed that includes a conductive material disposed in electrical contact with a semiconductor die, a protective mold structure disposed on the semiconductor die and a dielectric layer disposed on the semiconductor die and between the protect...