US Patent Issued to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY, BOE TECHNOLOGY GROUP on Sept. 9 for "Heat dissipation assembly, display module and display device" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,414,276, issued on Sept. 9, was assigned to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY Co. LTD. (Sichuan, China) and BOE TECHNOLOGY GROUP Co. LTD (Beijing).

"Heat dissipation assembly, display module and display device" was invented by Ren Xiong (Beijing), Zhihui Wang (Beijing), Lei Yang (Beijing), Xuan Luo (Beijing) and Fengping Wu (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation assembly includes a heat dissipation layer main body including at least one first side, arc-shaped corner side and second side, at least one first bending portion, second bending portion and corner bending portion. A first side, an arc-shaped corner side...