US Patent Issued to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY, BOE TECHNOLOGY GROUP on Sept. 23 for "Conductive adhesive film and fabrication method therefor, electronic device and manufacture method therefor" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,581, issued on Sept. 23, was assigned to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY Co. LTD. (Sichuan, China) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Conductive adhesive film and fabrication method therefor, electronic device and manufacture method therefor" was invented by Shaopeng Li (Beijing), Weiben Zhang (Beijing), Jianhua Shu (Beijing), Rongkun Fan (Beijing), Qiang Gou (Beijing), Tao Su (Beijing), Hao Deng (Beijing), Tianjun Deng (Beijing), Xiaolong Tang (Beijing), Wenze Li (Beijing), Cheng Zhang (Beijing), Fakui Sun (Beijing), Jing Zhang (Beijing), Yuan Liu (Beijing) and Dingjie Huang (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: ...