US Patent Issued to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY, BOE TECHNOLOGY GROUP on May 20 for "Display substrate including configuration of insulation layers covering contact pads in bonding region, and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,310,200, issued on May 20, was assigned to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY Co. LTD. (Chengdu, China) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Display substrate including configuration of insulation layers covering contact pads in bonding region, and manufacturing method thereof" was invented by Mengmeng Du (Beijing), Xiangdan Dong (Beijing), Hongwei Ma (Beijing), Jun Yan (Beijing), Bo Cheng (Beijing) and Biao Liu (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A display substrate and a manufacturing method thereof, and a display device are disclosed. The display substrate includes a base substrate, a plurality of sub-pixels, at least...