US Patent Issued to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY, BOE TECHNOLOGY GROUP on Feb. 18 for "Circuit board assembly, display assembly and assembling method therefor, and display device" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,897, issued on Feb. 18, was assigned to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY Co. LTD. (Sichuan, China) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Circuit board assembly, display assembly and assembling method therefor, and display device" was invented by Fengxian Wang (Beijing), Chuanyan Lan (Beijing), Qiang Tang (Beijing) and Xianlei Bi (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board assembly includes a connection circuit board, a near field communication antenna and solders. The connection circuit board includes circuit board pads. The near field communication antenna is attached to the connection circuit board, and th...