US Patent Issued to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY, BOE TECHNOLOGY GROUP on Feb. 18 for "Bending apparatus, device to be bent and machining method therefor, bent device, and display device" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,232,272, issued on Feb. 18, was assigned to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY Co. LTD. (Sichuan, China) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Bending apparatus, device to be bent and machining method therefor, bent device, and display device" was invented by Tianjun Deng (Beijing), Xiaolong Tang (Beijing), Shaopeng Li (Beijing), Weiben Zhang (Beijing), Rongkun Fan (Beijing), Wenze LI (Beijing), Xinfeng Zhou (Beijing), Junhao Ai (Beijing) and Cheng Zhang (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bending apparatus includes a fixing structure, a first driving mechanism, a first pressing head connected to the first driving mecha...