US Patent Issued to Chengdu BOE Optoelectronics Technology, Beijing BOE Technology Development on Oct. 21 for "Reinforcement board for flexible printed circuit board, flexible printed circuit board assembly, and display device" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,453,002, issued on Oct. 21, was assigned to Chengdu BOE Optoelectronics Technology Co. Ltd. (Sichuan, China) and Beijing BOE Technology Development Co. Ltd. (Beijing).

"Reinforcement board for flexible printed circuit board, flexible printed circuit board assembly, and display device" was invented by Fei Li (Beijing), Xinpeng Wang (Beijing), Wenxiao Niu (Beijing), Hao Huang (Beijing), Zijian Wang (Beijing), Xiaolong Zhu (Beijing), Xu Lu (Beijing) and Hengzhen Liang (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A reinforcement board for a flexible printed circuit, a flexible printed circuit assembly, and a display device. The reinforcement boar...