US Patent Issued to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY, BEIJING BOE TECHNOLOGY DEVELOPMENT on Nov. 4 for "Flexible printed circuit board and method for manufacturing the same, and display device" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,635, issued on Nov. 4, was assigned to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY Co. LTD. (Sichuan, China) and BEIJING BOE TECHNOLOGY DEVELOPMENT Co. LTD. (Beijing).

"Flexible printed circuit board and method for manufacturing the same, and display device" was invented by Wen Liu (Beijing), Xin Li (Beijing) and Zhixin Cui (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A flexible printed circuit board includes a substrate, a first conductive layer, a first protective layer and a support body. The substrate has a device region and a non-device region, and the device region is configured to be coupled to a chip. The first conductive layer is locat...