US Patent Issued to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY, BEIJING BOE TECHNOLOGY DEVELOPMENT on Nov. 25 for "Display module, display device and heat dissipation assembly" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,484,204, issued on Nov. 25, was assigned to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY Co. LTD. (Sichuan, China) and BEIJING BOE TECHNOLOGY DEVELOPMENT Co. LTD. (Beijing).

"Display module, display device and heat dissipation assembly" was invented by Zhihong Cui (Beijing) and Binfeng Feng (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A display module, display device and heat dissipation assembly are provided. The display module includes a display panel and a heat dissipation structure. The heat dissipation structure includes an adhesive layer adhered to a back side of the display panel, a first foam layer located on a side of the adhesive layer aw...