ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,990, issued on July 22, was assigned to CHENG UEI PRECISION INDUSTRY Co. LTD. (New Taipei, Taiwan).
"Telescopic structure of headphone" was invented by Chin-Chung Lin (New Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A telescopic structure of a headphone includes a headband, a cover, a slider, two damping elements and a cable. A front end of an inner surface of the headband defines a first concave surface. The cover is disposed to the front end of the inner surface of the headband. A front end of an internal surface of the cover is recessed inward to form a second concave surface. The second concave surface is corresponding to the f...