US Patent Issued to CHENG MEI INSTRUMENT TECHNOLOGY on Jan. 13 for "Method and device of inspecting surface of interconnect structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,523,619, issued on Jan. 13, was assigned to CHENG MEI INSTRUMENT TECHNOLOGY Co. LTD. (Hsinchu County, Taiwan).

"Method and device of inspecting surface of interconnect structure" was invented by Chin-Yu Liu (Hsinchu County, Taiwan), Chih-Yuan Lin (Hsinchu County, Taiwan), Hung-Chun Lo (Hsinchu County, Taiwan), Chao-Yu Huang (Hsinchu County, Taiwan), Chun-Pin Hsu (Hsinchu County, Taiwan) and Cheng-Tao Tsai (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method and device of inspecting a surface of an interconnect structure are provided. The interconnect structure includes a first metal layer, second metal layer, and dielectric la...