US Patent Issued to CHANGZHOU GALAXY CENTURY MICROELECTRONICS on May 27 for "Chip scale package (CSP) process" (Chinese Inventor)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,773, issued on May 27, was assigned to CHANGZHOU GALAXY CENTURY MICROELECTRONICS Co. LTD (Changzhou, China).

"Chip scale package (CSP) process" was invented by Yueyun Wang (Changzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip scale package process includes: forming a groove on an upper surface of a multi-device wafer; forming a passivation layer on the upper surface and in the groove; forming an opening of the passivation layer; forming a metal bump in the opening; adding a protective layer on the upper surface and in the groove; conducting a treatment after adding the protective layer on the upper surface and in the groove to expo...