US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on Oct. 14 for "Semiconductor package structure and manufacturing method" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,727, issued on Oct. 14, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China).

"Semiconductor package structure and manufacturing method" was invented by Xiaofei Sun (Hefei, China) and Changhao Quan (Hefei, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure is provided. The semiconductor package structure includes: a first package structure, including an intermediary layer and a molding compound, where a plurality of first connection pads are disposed on the intermediary layer, and the molding compound wraps the intermediary layer and is coplanar to the plurality of first connection pads; and a second p...