US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on May 6 for "Package substrate and semiconductor structure with package substrate" (Chinese Inventor)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,964, issued on May 6, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China).

"Package substrate and semiconductor structure with package substrate" was invented by Hailin Wang (Hefei, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package substrate and a semiconductor structure with the package substrate are provided. The package substrate includes a body and a conductive layer. The body includes an opening region. The conductive layer is disposed at the opening region. The conductive layer includes a first conductive bridge and a second conductive bridge. The first conductive bridge and the second conductive bridge are disposed a...