US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on May 27 for "Wafer bonding device and wafer bonding method" (Chinese Inventor)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,839, issued on May 27, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China).

"Wafer bonding device and wafer bonding method" was invented by Chih-Wei Chang (Hefei, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer bonding device includes: a first fixing apparatus fixing a first wafer, on which a first alignment mark is disposed; a second fixing apparatus fixing a second wafer, on which a second alignment mark is disposed, the second fixing apparatus being disposed opposite to the first fixing apparatus; a reflection member between the first and second fixing apparatuses; a mark reader which reads position information about the...