US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on July 8 for "Chip package structure and storage system" (Chinese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,941, issued on July 8, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China).

"Chip package structure and storage system" was invented by Shu-Liang Ning (Hefei, China), Jun He (Hefei, China), Jie Liu (Hefei, China) and Zhan Ying (Hefei, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package structure and a storage system are provided. The chip package structure includes a chipset, a first Re-Distribution Layer (RDL), and a bonding pad region. The chipset includes a plurality of chips distributed horizontally. The first RDL is disposed on a first surface of the chipset. The bonding pad region includes a plurality of bonding pad...