US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on Jan. 13 for "Semiconductor package structure and method for preparing same" (Chinese Inventor)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,575, issued on Jan. 13, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China).

"Semiconductor package structure and method for preparing same" was invented by Ling-Yi Chuang (Hefei, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure and a method for preparing the same are provided. The semiconductor package structure includes: a substrate; a first semiconductor chip located on the substrate, the first semiconductor chip having a first surface that is bare and the first surface having a silicon-containing surface; second semiconductor chip structures located on the first surface of the first semiconducto...