US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on Dec. 30 for "Semiconductor package assembly and manufacturing method" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,447, issued on Dec. 30, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China).

"Semiconductor package assembly and manufacturing method" was invented by Xiaofei Sun (Hefei, China) and Changhao Quan (Hefei, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package assembly and manufacturing method are provided. The assembly includes: a base plate having a first surface; a chip stacking structure located on the base plate, the chip stacking structure including multiple chips sequently stacked in a direction perpendicular to the base plate and being electrically connected to the first surface; an interposer located on the ...