US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on Dec. 30 for "Package structure and method for forming same" (Chinese Inventor)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,426, issued on Dec. 30, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China).

"Package structure and method for forming same" was invented by Ling-Yi Chuang (Hefei, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes the following: a logic die; and a plurality of core dies sequentially stacked on the logic die along a vertical direction, in which the plurality of core dies include a first core die and a second core die interconnected through a hybrid bonding member; the hybrid bonding member includes: a first contact pad located on a surface of the first core die; and a second contact pad located on a surfac...