US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on Dec. 2 for "Package structure and method for fabricating same" (Chinese Inventor)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,094, issued on Dec. 2, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China).

"Package structure and method for fabricating same" was invented by Mingxing Zuo (Hefei, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments relate to the field of semiconductors, and provide a package structure and a method for fabricating the same. The package structure includes: a stack including a plurality of semiconductor devices stacked; a plurality of electrical connection portions positioned on a same side of the stack, each of the electrical connection portions being electrically connected to a corresponding semiconductor device, wherein in...