ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,382,625, issued on Aug. 5, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China) and BEIJING SUPERSTRING ACADEMY OF MEMORY TECHNOLOGY (Beijing).
"Semiconductor structure and manufacturing method thereof" was invented by Guangsu Shao (Hefei, China), Deyuan Xiao (Hefei, China) and Yong Yu (Hefei, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to the technical field of semiconductors, and provides a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes: a base, and bit lines, word lines, active pillars, and a memory structure that are located on the base. The bit line...