US Patent Issued to CHANGXIN MEMORU TECHNOLOGIES on Sept. 16 for "Chip packaging structure and method for preparing the same, and method for packaging semiconductor structure" (Chinese Inventor)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,995, issued on Sept. 16, was assigned to CHANGXIN MEMORU TECHNOLOGIES INC. (Hefei, China).

"Chip packaging structure and method for preparing the same, and method for packaging semiconductor structure" was invented by Zengyan Fan (Hefei, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip packaging structure and a method for preparing the same, and a method for packaging a semiconductor structure are provided, which relate to the technical field of semiconductors, and solve the technical problem of low yield of a chip. The chip packaging structure includes: a chip, an intermediate insulating layer arranged on the chip and a non-conductive a...