US Patent Issued to CHANGSHA UNIVERSITY OF SCIENCE & TECHNOLOGY on Sept. 16 for "Rubber particle-doped composite chip seal and construction method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,416,119, issued on Sept. 16, was assigned to CHANGSHA UNIVERSITY OF SCIENCE & TECHNOLOGY (Changsha, China).

"Rubber particle-doped composite chip seal and construction method thereof" was invented by Jianguo Wei (Changsha, China), Yuming Zhou (Changsha, China), Hao Yue (Changsha, China), Anmin Zou (Changsha, China), Ping Li (Changsha, China), Haolong Ju (Changsha, China), Qiucai Nan (Changsha, China) and Min Fu (Changsha, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A rubber particle-doped composite chip seal and a construction method thereof. The rubber particle-doped composite chip seal includes a coarse aggregate in a lower layer, a fine agg...