US Patent Issued to CHA UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION, SUNGKWANG MEDICAL FOUNDATION on June 24 for "Three-dimensional biomimetic chip for simulating endometrium, and endometrium simulating method using same" (South Korean Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,338,422, issued on June 24, was assigned to CHA UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION (Pocheon-si, South Korea) and SUNGKWANG MEDICAL FOUNDATION (Seoul, South Korea).

"Three-dimensional biomimetic chip for simulating endometrium, and endometrium simulating method using same" was invented by Youn Jung Kang (Yongin-si, South Korea), Jung Ho Ahn (Seongnam-si, South Korea), Min Ji Yoon (Seoul, South Korea), Hwi Jae Cha (Seoul, South Korea) and Seon Hwa Hong (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a biomimetic chip for three-dimensionally simulating an endometrium, and an endome...