ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,330, issued on May 20, was assigned to Ceremorphic Inc. (San Jose, Calif.).
"Chip to chip interconnect beyond sealring boundary" was invented by Robert Wiser (Santa Cruz, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A plurality of integrated circuits each have a central interconnect region which is enclosed by an inner sealring, optional intermediate sealrings, and an outer sealring. Each sealring has a sealring gap for passage of a signal trace which connects a central interconnect of a first integrated circuit to a central interconnect of a second integrated circuit. In first example of the invention, the signal trace remains on a single ...