US Patent Issued to Cerebras Systems on Nov. 4 for "Apparatus and method for fabricating multi-die interconnection using lithography process" (California Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,139, issued on Nov. 4, was assigned to Cerebras Systems Inc. (Sunnyvale, Calif.).

"Apparatus and method for fabricating multi-die interconnection using lithography process" was invented by Jean-Philippe Fricker (Mountain View, Calif.) and Philip Ferolito (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor and a method of fabricating the semiconductor having multiple, interconnected die including: providing a semiconductor substrate having a plurality of disparate die formed within the semiconductor substrate, and a plurality of scribe lines formed between pairs of adjacent die of the plurality of disparate die; and fabri...