US Patent Issued to CENTRAL SOUTH UNIVERSITY on May 20 for "Composite VC heat sink containing copper/diamond composite wick structure and method for preparing same" (Chinese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,305,928, issued on May 20, was assigned to CENTRAL SOUTH UNIVERSITY (Changsha, China).

"Composite VC heat sink containing copper/diamond composite wick structure and method for preparing same" was invented by Qiuping Wei (Changsha, China), Kechao Zhou (Changsha, China), Li Ma (Changsha, China) and Xi Wang (Changsha, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A composite VC heat sink containing a copper/diamond composite wick structure and a method for preparing the same are provided. The VC heat sink includes a lower shell plate. The lower shell plate is provided with a recess at a center position of an inner surface and provided with a boss w...