US Patent Issued to Central South University on April 1 for "Method for preparing tensile specimen of epoxy structural adhesive and vibration curing device" (Chinese Inventors)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,263,625, issued on April 1, was assigned to Central South University (Changsha, China).

"Method for preparing tensile specimen of epoxy structural adhesive and vibration curing device" was invented by Lihua Zhan (Changsha, China), Dechao Zhang (Changsha, China), Bolin Ma (Changsha, China), Bang Xiong (Changsha, China) and Shunming Yao (Changsha, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure discloses a method for preparing a tensile specimen and a vibration curing device. The method includes obtaining a colloid mixture and putting it into a beaker and using a stirring device to stir the colloid mixture mixed evenly. The met...