US Patent Issued to CelLink on July 15 for "Multilayered flexible interconnect circuits for battery assemblies and methods of fabricating and installing thereof" (Michigan, California Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,437, issued on July 15, was assigned to CelLink Corp. (San Carlos, Calif.).

"Multilayered flexible interconnect circuits for battery assemblies and methods of fabricating and installing thereof" was invented by Gabrielle Tate (Royal Oak, Mich.), Jean-Paul Ortiz (White Lake, Mich.) and Will Findlay (San Carlos, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are multilayered flexible interconnect circuits comprising multiple conductive layers. Also provided are methods of fabricating such circuits and also methods of fabricating battery assemblies with such circuits. A multilayered flexible interconnect circuit comprises at least two c...