US Patent Issued to Celestial AI on May 13 for "Optically bridged multicomponent package with extended temperature range" (California Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,298,608, issued on May 13, was assigned to Celestial AI Inc. (Santa Clara, Calif.).

"Optically bridged multicomponent package with extended temperature range" was invented by Philip Winterbottom (San Jose, Calif.), David Lazovsky (Los Gatos, Calif.), Ankur Aggarwal (Pleasanton, Calif.), Martinus Bos (San Jose, Calif.) and Subal Sahni (La Jolla, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package comprises a photonic integrated circuit (PIC) with a modulator having a first modulator input, and a PIC interconnect region within two millimeters or fifty microns from the modulator. Additionally, an electric integrated circuit (EIC) is included wi...