US Patent Issued to Celestial AI on March 4 for "Multicomponent photonically intra-die bridged assembly" (California Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,242,122, issued on March 4, was assigned to Celestial AI Inc. (Santa Clara, Calif.).

"Multicomponent photonically intra-die bridged assembly" was invented by Philip Winterbottom (San Jose, Calif.), David Lazovsky (Los Gatos, Calif.), Ankur Aggarwal (Pleasanton, Calif.), Martinus Bos (San Jose, Calif.) and Subal Sahni (La Jolla, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a first die with a compute element and first region, a second die with a compute element and second region, and a bridging element connecting the first and second dies. The bridging element includes interconnect regions for electrical coupling, a first photo...