US Patent Issued to Celestial AI on Dec. 9 for "Preserving access to optical components on a wafer package with sacrificial die" (California, Arizona Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,403, issued on Dec. 9, was assigned to Celestial AI Inc. (Santa Clara, Calif.).

"Preserving access to optical components on a wafer package with sacrificial die" was invented by Ankur Aggarwal (Pleasanton, Calif.), Subal Sahni (La Jolla, Calif.), Anmol Rathi (San Jose, Calif.) and Suresh Venkata Pothukuchi (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to packaging techniques in connection with packaging electrical and optical components within circuit packages. For example, one or more examples described herein involve techniques for packaging an electro-photonic circuit while preserving access to a gr...