US Patent Issued to Celestial AI on Aug. 26 for "Optical multi-die interconnect bridge with electrical and optical interfaces" (California Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,399,333, issued on Aug. 26, was assigned to Celestial AI Inc. (Santa Clara, Calif.).

"Optical multi-die interconnect bridge with electrical and optical interfaces" was invented by Philip Winterbottom (San Jose, Calif.), David Lazovsky (Los Gatos, Calif.), Ankur Aggarwal (Pleasanton, Calif.), Martinus Bos (San Jose, Calif.) and Subal Sahni (La Jolla, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a bridging element (an OMIB), and first and second photonic paths, forming a bidirectional photonic path. The OMIB has first and second interconnect regions to connect with one or more dies. Third and fourth unidirectional photonic path...