US Patent Issued to Celestial AI on Aug. 26 for "Electrical interconnects for packages containing photonic integrated circuits" (California Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,401,006, issued on Aug. 26, was assigned to Celestial AI Inc. (Santa Clara, Calif.).

"Electrical interconnects for packages containing photonic integrated circuits" was invented by Matteo Staffaroni (San Ramon, Calif.), Kevin Park (Santa Clara, Calif.), Saurabh Vats (Palo Alto, Calif.), Subal Sahni (La Jolla, Calif.) and Ismail Hakki Ozguc (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system-in-package includes: a photonic integrated circuit (PIC) including an active photonic component; and an electronic integrated circuit (EIC) stacked on the PIC, the EIC including: an electrical component electrically connected to a landing pad...