US Patent Issued to Celestial AI on April 22 for "Electrical bridge package with integrated off-bridge photonic channel interface" (California Inventor)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,584, issued on April 22, was assigned to Celestial AI Inc. (Santa Clara, Calif.).

"Electrical bridge package with integrated off-bridge photonic channel interface" was invented by Ankur Aggarwal (Pleasanton, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a circuit package is described that includes connecting a photonic interposer and a second interposer, connecting a die to both the photonic interposer and the second interposer, where the die partially overlaps both the photonic interposer and the second interposer, and connecting an optical element to the photonic interposer."

The patent was filed on Jan. 8, 2024, ...