US Patent Issued to CARNEGIE MELLON UNIVERSITY on June 24 for "Polycarbonate heat molding for soft lithography" (Pennsylvania Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,339,585, issued on June 24, was assigned to CARNEGIE MELLON UNIVERSITY (Pittsburgh).

"Polycarbonate heat molding for soft lithography" was invented by Philip R. LeDuc (Pittsburgh) and Utku Sonmez (Pittsburgh).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of replicating master molds used in the fabrication of microsystems having micron to millimeter sized features. Master molds are replicated using a polymer sheet, which is heated and melted onto an elastomeric mold fabricated from the master mold. The copy molds accurately replicate the geometries of the master mold, such as high aspect ratio features, microposts, and channels with slender side...