ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,705, issued on April 29, was assigned to Carl Zeiss SMT GmbH (Oberkochen, Germany).

"FIB-SEM 3D tomography for measuring shape deviations of HAR structures" was invented by Amir Avishai (Pleasanton, Calif.), Alex Buxbaum (San Ramon, Calif.), Eugen Foca (Ellwangen, Germany), Dmitry Klochkov (Schwaebisch Gmuend, Germany), Thomas Korb (Schwaebisch Gmuend, Germany) and Keumsil Lee (Palo Alto, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A 3D tomographic inspection method for the inspection of semiconductor features in an inspection volume of a semiconductor wafer includes obtaining a 3D tomographic image, and selecting a plurality of 2D cross se...