US Patent Issued to Carl Zeiss SMT on April 22 for "Contact area size determination between 3D structures in an integrated semiconductor sample" (German, American Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,504, issued on April 22, was assigned to Carl Zeiss SMT GmbH (Oberkochen, Germany).

"Contact area size determination between 3D structures in an integrated semiconductor sample" was invented by Alex Buxbaum (San Ramon, Calif.), Amir Avishai (Pleasanton, Calif.), Dmitry Klochkov (Schwaebisch Gmuend, Germany), Thomas Korb (Schwaebisch Gmuend, Germany), Eugen Foca (Ellwangen, Germany) and Keumsil Lee (Palo Alto, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of determining a size of a contact area between a first 3D structure and a second 3D structure in an integrated semiconductor sample, includes the following steps: obtaining at least...